Werner, I agree with what you say especially the part about boards being left in reflow over lunch. That's exactly what I had in mind as one part of an uncontrolled solder coating process. I didn't make my statement very well, obviously, and I certainly didn't want to mislead the original questioner. Really, I was trying to comment on how poorly some HASL processes are managed at cleaning, rinsing, drying (often effecting excessive oxidation), and fluxing (often not effecting excessive oxidation removal) not withstanding often allowing boards to be subjected to excessive heat for longer periods than acceptable, over lunch or not, thus creating unsolderable surfaces. Nothing solders to solder - that's for sure. Nothing solders to a "ruined" solder surface produced in a poorly managed process. HASL often is easy to manage poorly. Earl --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------