Gents, If you are using a SmartSonic Ultrasonic cleaner, their technical people say that because they alternate their ultrasonic frequency, damage to die bonds should not occur. You might want to give your Ultrasonic cleaner representitive a call to find out more specifics. Steve A > -----Original Message----- > From: Guy Ramsey [SMTP:[log in to unmask]] > Sent: Friday,October 26,2001 12:15 PM > To: [log in to unmask] > Subject: Re: [TN] Cleaning paste when misaligned. > > I don't mean to cause any undue concern. The issue is fairly simple . . . > You can break glass and ceramic with sound but it is not likely if you are > careful. But ultrasonic cleaning can break wire bonds, and wires, this is > especially true in controls, ceramic ICs and the like were the wires are > not encapsulated and subject to vibration. There are technologies that are > effective in reducing this type of damage. Hope this relieves your fear. > If you are still concerned then you have some homework to do. What > frequency and power does you cleaner work at. What is a construction of > the packages in question . . . stuff like that. > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]]On Behalf Of Howard Watson > Sent: Friday, October 26, 2001 11:46 AM > To: [log in to unmask] > Subject: Re: [TN] Cleaning paste when misaligned. > > > > Mike and Guy, > > We routinely clean the second side of misprint solder paste, but > from what you are saying perhaps there could be a problem with damaging > some components. The components that we clean in the ultrasonic cleaner > are mostly flat chip package, C lead diodes, and some SOT-23 and SOIC. > How do I verify which components can or cannot go in the cleaner? Is > there any test data out there to support this issue? Though we clean very > few misprints, I am a little concerned. Thanks for your help! > > Howard Watson > Manufacturing Engineer > AMETEK/Dixson > > > > "Barmuta, Mike" <[log in to unmask]> > Sent by: TechNet <[log in to unmask]> > > 10/26/01 09:02 AM > Please respond to "TechNet E-Mail Forum." > > > > To: [log in to unmask] > cc: > Subject: Re: [TN] Cleaning paste when mis-aligned. > > > > Cathy: This should not be a problem for the bare (unloaded) PCB. > However if > you are doing a double sided reflow and misprint the second side > you need > to verify that the first side components are compatible with the > ultrasonics > you are using. > > > Regards > > Michael Barmuta > > Staff Engineer > > Fluke Corp. > > Everett WA > > 425-446-6076 > > -----Original Message----- > From: Cathy Killen [mailto:[log in to unmask]] > Sent: Friday, October 26, 2001 7:30 AM > To: [log in to unmask] > Subject: [TN] Cleaning paste when mis-aligned. > Importance: High > > > Hello All & the mountain dew man. > Can a mis-printed PCB be washed in a ultrasonic bath to remove all > paste > particles? > Is there any danger of damaging innerlayers of PCB? > > Thanks in advance. > > Cathy Killen > Training Instructor > Smtek Europe Ltd. > The information contained in the E-mail is confidential. It is > intended only > for the stated addressee(s) and access to it by any other person is > unauthorised. > The views expressed in this E-mail are those of the author, and do > not > represent the views of Smtek Europe, its associates or subsidiaries, > unless > otherwise expressly indicated. > Please note: It is your responsibility to scan this E-mail for > viruses. > > > -------------------------------------------------------------------------- > -- > ----- > Technet Mail List provided as a free service by IPC using LISTSERV > 1.8d > To unsubscribe, send a message to [log in to unmask] with following > text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt delivery of Technet send the following message: > SET > Technet NOMAIL > Search previous postings at: www.ipc.org > On-Line Resources & > Databases > > E-mail Archives > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > information, or contact Keach Sasamori at [log in to unmask] or > 847-509-9700 > ext.5315 > > -------------------------------------------------------------------------- > -- > ----- > > > -------------------------------------------------------------------------- > ------- > Technet Mail List provided as a free service by IPC using LISTSERV > 1.8d > To unsubscribe, send a message to [log in to unmask] with following > text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt delivery of Technet send the following message: > SET Technet NOMAIL > Search previous postings at: www.ipc.org > On-Line Resources & > Databases > E-mail Archives > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > information, or contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > > -------------------------------------------------------------------------- > ------- > > > > --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------