Thanks for all your
answers.
I found very usefull
information.
7711 - Rework of Electronic Assemblies
Covers procedures for reworking
electronic assemblies, either as part of the manufacturing process or after the
assemblies have been in the field. Describes the procedural requirements, tools,
materials and methods to be used in removing and replacing conformal coatings,
surface mount and through-hole components. Supersedes IPC-R-700C. 184 pages.
Released February 1998.
7721 - Repair and Modification of Printed Boards and Electronic
Assemblies
Covers procedures for modifying, reworking and repairing printed
boards and printed board assemblies. Prescribes the procedural requirements as
well as tools, materials and methods to be used in removing and replacing
conformal coatings and solder resist material. Also covers repair and
modification of printed board conductors, laminates and plated-through holes.
Supersedes IPC-R-700C. 156 pages. Released February 1998.
Purchase the IPC-7711/7721 series and save 20% over individual document
prices.
Jack
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Manufacturing, January 22-24, 2002, San Diego,
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Jack Crawford,
IPC Director of Assembly Standards and Technology
2215 Sanders Road,
Northbrook IL 60062-6135
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fax
847-504-2393
>>>
[log in to unmask] 10/25/01 02:45PM
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Hello to All,
We found that our prominent contributor to scrap
boards is the incorrect rework.
Where can I
find information about the recommended practices for the rework?
The major problem is in components with 20 and 25
mil of pitch and with though hole connectors.
Any help will be greatly appreciated
Regards,
Alejandro Becerra