Thanks for all your answers. I found very usefull information. -----Original Message----- From: Jack Crawford [mailto:[log in to unmask]] Sent: Thursday, October 25, 2001 1:28 PM To: [log in to unmask] Subject: Re: [TN] THE ANSWER!! Rework Procedures for electronic assemblies. 7711 - Rework of Electronic Assemblies Covers procedures for reworking electronic assemblies, either as part of the manufacturing process or after the assemblies have been in the field. Describes the procedural requirements, tools, materials and methods to be used in removing and replacing conformal coatings, surface mount and through-hole components. Supersedes IPC-R-700C. 184 pages. Released February 1998. 7721 - Repair and Modification of Printed Boards and Electronic Assemblies Covers procedures for modifying, reworking and repairing printed boards and printed board assemblies. Prescribes the procedural requirements as well as tools, materials and methods to be used in removing and replacing conformal coatings and solder resist material. Also covers repair and modification of printed board conductors, laminates and plated-through holes. Supersedes IPC-R-700C. 156 pages. Released February 1998. Purchase the IPC-7711/7721 series and save 20% over individual document prices. www.ipc.org/bookstore <http://www.ipc.org/bookstore> Jack ========================================== APEX - the industry's premier trade show in Electronics Manufacturing, January 22-24, 2002, San Diego, California. More information on website www.goapex.org <http://www.goapex.org> -------- Jack Crawford, IPC Director of Assembly Standards and Technology 2215 Sanders Road, Northbrook IL 60062-6135 [log in to unmask] <mailto:[log in to unmask]> 847-790-5393 fax 847-504-2393 >>> [log in to unmask] 10/25/01 02:45PM >>> Hello to All, We found that our prominent contributor to scrap boards is the incorrect rework. Where can I find information about the recommended practices for the rework? The major problem is in components with 20 and 25 mil of pitch and with though hole connectors. Any help will be greatly appreciated Regards, Alejandro Becerra