Why do you prefer immersion Silver over immersion Tin? -----Original Message----- From: Guy Ramsey [mailto:[log in to unmask]] Sent: Wednesday, October 03, 2001 7:07 AM To: [log in to unmask] Subject: Re: [TN] ENIG v Immersion Ag Be aware that the wetting forces are lower and wetting too is slower on ENIG than with HASL or Immersion Silver, or for that matter bare copper. This is because you are soldering to nickle, not copper. Make sure that the time above liquidus is long enough and the that temperature under the BGA is hot enough. You should be able to solder to the ENIG. Our experience with Immersion Silver has been positive. I prefer it over Immersion Tin. But I do not have data to answer your other questions. Guy Ramsey Senior Lab Technician / Instructor E-Mail: [log in to unmask] <mailto:[log in to unmask]> Ph: (610) 362-1200 x107 Fax: (610) 362-1290 -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Kirsch, Clif Sent: Tuesday, October 02, 2001 4:45 PM To: [log in to unmask] Subject: [TN] ENIG v Immersion Ag We are running into solderability issues with ENIG boards, especially under dense (500+ pins) BGA devices. Once the BGA is removed some of the pads indicate they did not / will not wet. Does anyone have experience with immersion silver finished boards from a reliability and NEBS compliant standpoint? Also are there surface resistance issues for test pads that are not reflowed with solder? Clif Kirsch Mfg Eng ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------