BGA Guru's, We're doing a big project that requires removal/replacement of several hundred plastic BGA components. After removal we'll be reballing the BGA's and then reinstalling them. These are new builds, they're not coming back from the field. Who knows what J-STD-20, or any other reference, says about prebaking temp/time to eliminate possible moisture problems in the components or boards prior to initial removal? Removed parts will be stored in a desiccant chamber before and after reballing. Do we need to bake these parts again prior to installation? Do ya'all normally bake new build boards in this situation? Thanks for you recommendations. Jeff Ferry CEO Circuit Technology Center, Inc. --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------