Hi Steve, Thanks for the prompt response. What kind of solder thieves should I put in, say a SOIC08? Do I need to put in leading pads and leading pads? Is there any standard published that I can find or buy regarding wave soldering issues? Thanks for the support. Patrick Steve Owen <[log in to unmask]> on 10/23/2001 09:03:04 AM Please respond to "TechNet E-Mail Forum." <[log in to unmask]> To: [log in to unmask] cc: (bcc: Patrick Lam/SEL) Subject: Re: [TN] Land pattern for wave soldering Hi Patrick, If you look at say a side one footprint(reflow)for quad flat pack as opposed to a side two (wavesolder)side. On side two you will ideally need to present the component @ 45 deg to the wave and have solder thieves in each of the four corners to eliminate solder bridges. just an example. hope its of some use. -----Original Message----- From: Patrick Lam [mailto:[log in to unmask]] Sent: 23 October 2001 16:26 To: [log in to unmask] Subject: [TN] Land pattern for wave soldering Hi Technetters, Is there a need to have different SMD land size/ pattern for wave soldering? Any suggestion is appreciated. Thanks, Patrick --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------