We are running into solderability issues with ENIG boards, especially under
dense (500+ pins) BGA devices. Once the BGA is removed some of the pads
indicate they did not / will not wet.

Does anyone have experience with immersion silver finished boards from a
reliability and NEBS compliant standpoint? Also are there surface resistance
issues for test pads that are not reflowed with solder?

Clif Kirsch
Mfg Eng

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