We are running into solderability issues with ENIG boards, especially under dense (500+ pins) BGA devices. Once the BGA is removed some of the pads indicate they did not / will not wet. Does anyone have experience with immersion silver finished boards from a reliability and NEBS compliant standpoint? Also are there surface resistance issues for test pads that are not reflowed with solder? Clif Kirsch Mfg Eng --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------