We are experiencing a problem that I could definitely use some help trying to determine what is going on. The board is a very thin (0.020") pcmcia size card manufactured out of Getek material with a Immersion Gold over Electroless Nickel finish. We are seeing a fairly high failure rate out of the initial assembled boards. The failure mode appears to be broken connections in one particular corner of the BGA. The break is actually occurring where it is ripping the pad off the board. I have a couple of engineers here that claimed they had the same problem on a different board about 2 years ago and solved the problem by going to a HASL finish from a Immersion Gold over Electroless Nickel finish. I find that hard to believe, but am open to suggestions from anyone out on TechNet. Mike Duggan NPI - SQE Intermec Technologies Corp. Phone: 319-369-3364 Fax: 319-369-3722 Pager: 800-251-7921 e-mail: [log in to unmask] --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------