Hello Technetters, I was wondering if anyone elso is placing the National Semiconductor Micro SMD Component. Our team in RTP was looking for some rework answers. They are able to remove the part with a hot air pencil, but part replacement has been tough. The 8 bump WLCSP (Waffer Level Chip Scale Package) is only 1.4mm x 1.4mm- smaller than an 0805 component. The rework machine vacuum tube cannot handle the component, and the mini micro stencil process is almost impossible because the components are packed together so tightly- it is not easy to get sufficient tacky flux down on the .0065" diameter pad either. A redesign is not feasible. Short of creating a special jig to hold the component in place as a hot air pencil is used to reflow, has anyone got any ideas. National Semiconductor tells me to use the same process as we would for any CSP, but this part is just too small for the SRT rework machine. Has anyone dealt with solder ladden preforms that are in the sub .010" range? Here is the WEB site of the package. http://www.national.com/packaging/other.html#microSMD Steve A --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------