To Marichu's defense, he has asked the question to the limit of the available defect description. To the other replies, you are correct in asking for more information to answer the question. Perhaps categorizing poor wetting/insufficient solder/dewetting/non-wetting in more causal descriptive terms would be useful. It is the difference between describing a symptom vs. describing a cause. How and when is performance affected by these characteristics? Does it vary by circuit application? In other words when are they no longer cosmetic defects? In terms of inspection performance, the yield of attempting to screen out any of these characteristics is poor. It is also futile to measure if action on controlling solder process inputs is not taken. If you have reached the performance limit of the solder process and the defects are still present - how can the affect on product be assessed? Steve Shoda BAE SYSTEMS Controls -----Original Message----- From: Marichu S. Amalin [mailto:[log in to unmask]] Sent: Thursday, October 04, 2001 7:59 PM To: [log in to unmask] Subject: [TN] Poor wetting on solder joints What could be the cause of poor wetting on solder joints and how we can solve it? ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------