I still live in the glass plate and matrix world. Simple correlations between variables as conveyor speed, temps, topside measurements, managing fluxes and their applications, wave height, contact area parallelism and dwell time all make solder joint attributes clearly acceptable or not. SPC is used in a number of the variables and provides, again, correlation to the matrix (relative to PCB thermal mass, as an example) and the effects of good process management. Though wave soldering has a few more factors, compared with hand or reflow soldering, the basics are all the same, to me, for each. I'm a simple fool and can't change at this point when it works. MoonMan --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------