Don't know how I got posted twice. No matter, forgot to address thermal. Based on the dual postings, it is obvious CIC can do TCE but it also can do thermal whether constraining thick core of thin tailoring core but why go to all that fuss? If Steve will indulge again, I did a 10 oz Cu internal thermal relief core at about the same time as all the CIC stuff. The 10 oz core could be two 5 oz cores as well. One picture shows a 10 oz copper plain sandwiched between two, three, or four layer MLB's much as with the CIC. The other picture shows a finished MLB with "rails" on either side of the board with holes drilled into the rails. They acted as heat pipes to a cold wall connection for thermal relief using liquid cooling. Some of you might remember this application used in VLSI test equipment at the time. The lamination trick with the 10 oz stuff was, of course, to use very high resin content preg so it would fill around and through the Cu and its holes. MoonMan --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------