Currently I'm working with a supplier of ours that is having quality issues in snapping there alumina substrates lending to excessive chipping and microcracking. I would like to know what the standard is in the industry for scoring, snapping and chipping of .040" alumina substrates. Currently there item is a 2-up substrate that is laser scored. Due to the excessive chipping we are seeing random field return failures due to microcracking of the substrate. Any insight or help would be greatly appreciated. --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------