Currently I'm working with a supplier of ours that is having quality issues
in snapping there alumina substrates lending to excessive chipping and
microcracking. I would like to know what the standard is in the industry
for scoring, snapping and chipping of .040" alumina substrates. Currently
there item is a 2-up substrate that is laser scored. Due to the excessive
chipping we are seeing random field return failures due to microcracking of
the substrate. Any insight or help would be greatly appreciated.

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