Thanks go out to Phil N., Mike, Bill, Hans and Phil C for the tips on mold development. I will certainly incorporate draft angles and slots in the mold to facilitate extraction of the part. I will also look into a flexible material for the actual mold itself. I must say that it is really neat to have over 1200 consultants at your fingertips willing to help out with any assembly problem. The technet network is to be commended for its rapid response and expert advice. Thanks again to all who responded to my post. Bill Kasprzak Moog Inc., Electronic Assembly Engineering > -----Original Message----- > From: Crepeau, Phil [SMTP:[log in to unmask]] > Sent: Monday, July 16, 2001 1:09 PM > To: [log in to unmask] > Subject: Re: [TN] Recommendations for developing a mold > > hi, > > i think the suggestions for adding a draft angle to the walls of the mold > are what you need. i'd also suggest that stay with an aluminum mold and > get the inside of the mold teflon coated. your parts will come out > without any release on them. also you might think about cutting slots at > the seam of the mold so that you can get something like a screwdriver in > there to help pry the pieces of the mold apart. > > phil > > --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 --------------------------------------------------------------------------------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------