Sasha I like your idea about the wave solder but unfortunatly it wont work with this application. The are MICRO BGAs on both sides of the board. The backside ground part is on the top side ( with MINi leds) and there are unsealed mini pots on the bottom. What we did find was a discrepancy in the customers gerbers. The paste layer was too small for the amount of pad. We are going to attempt a modification of the stencil by opening up 2 narrow slots radiating out from the existing appature. Thanks for all the ideas --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------