Just been talking with someone also much respected in this field. The following is my response to his answere: Besides the glass brush talked about in other discussions, my biggest concerns are about fine pitch and BGA device types and the solder termination area topography required (flat)to effect placement, continued alignment, and subsequent reflow and "acceptable" solder joint formation - not only as first required but for rework. As you know and have observed many times, once device removal is effected, the solder left is very uneven, to say the least. This, again as you know, is why we carefully wick off, or otherwise remove the solder left after the component removal process. This, then, is the dilemma as I see it. In your terms, we now expose an IMC layer after the solder removal process, to whatever extent, preventing solder "wetting" in some areas not quantifiable. I guess, this is a random occurrence (where and how much IMC) is left. Therefore, doesn't this point to sh luck to again effect "acceptable solder joints or is it of no consequence - for the most part as Wolfgang said. Earl --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------