Hello everyone, I have recently had an engineers board flag up a soldering problem on the shop floor. (although I think that its only cosmetic) C type pads were tried to allow a plastic connector to be hand soldered at 2nd stage, without the need for masking etc before it went through the solder wave. The connector cannot go through as it has retaining lugs that clip under the edge of the board and would melt. However, this c-type pad (std pad with 1mm slot in it) does not produce a 100% circumference solder joint, it only produces about 75% once hand soldered. I have looked at IPC-A-610C 6.3.2.1 and I "think" that it says that its OK, I'm not too sure. Its for use in a fire detection system so I think that this would be class 3, again I'm not sure. Can anyone give me some advise on this please. N.B. Although I have seen the IPC spec, we have not adopted them as a standard for the shop floor so until I can get them to adopt it, this is only a fact finding exercise. Thankyou. Matthew Lamkin. Snr PCB Draughtsman, Protec Fire Detection PLC. --------------------------------------------------------------------------------- DesignerCouncil Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF DesignerCouncil. To set a vacation stop for delivery of DesignerCouncil send: SET DesignerCouncil NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------