>>> "Brooks,Bill" <[log in to unmask]> 09/19/01 10:23AM >>> I attended one of Rick Hartley's seminars at PCB West in Santa Clara, CA. a while back... He talked of creating a board stackup with the power and ground planes very close together in the inner core of the material... thus creating a bypassing capacitive effect for High speed logic boards. The distance specified was like 2 to 3 mils apart. How would you go about constructing a board with this feature in it? I have had a board manufacturer tell me that 'the board would warp with all that prepreg in it'... and the smallest core he had was 5 mil, could not get 3 mil. Is this just a stackup configuration problem or is there more to it? Comments welcome... :) Bill Brooks PCB Design Engineer , C.I.D. DATRON WORLD COMMUNICATIONS, INC 3030 Enterprise Court Vista, CA 92083 Tel: (760)597-1500 Ext 3772 Fax: (760)597-1510 mailto:[log in to unmask] IPC Designers Council, San Diego Chapter http://www.ipc.org/SanDiego/ http://home.fda.net/bbrooks/pca/pca.htm --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------