>>> "Ashok Dhawan" <[log in to unmask]> 09/18/01 01:57PM >>> Ken IPC-HDBK-001 does specify the conditions when you can use piggy backing of components." Except when required in high frequency applications, stacking of components should not be permitted in initial design. ......Stacking usually occurs when the existing design must be modified to incorporate additional components on the assembly......Stacking should be documented on the assembly drawing." Refer to Figure 6-24. The pitfalls I can think of, is overheating of parts as they are stacked, constriction of solder flux between parts, inconsistance process and also, difficulty in automating the process. Thermal dissipation can be an issue. If volume is too low and it is not economical to respin the fab and it does not make functional problems , I will say why not use Stacking and document it. Ashok > -----Original Message----- > From: TechNet [mailto:[log in to unmask]]On Behalf Of Jack Crawford > Sent: Tuesday, September 18, 2001 12:17 PM > To: [log in to unmask] > Subject: Re: [TN] Piggy Backing of passives...Why one should go for > addtional fab spin? > > > >>> Ken Patel <[log in to unmask]> 09/18/01 11:06AM >>> > All, > What are the major reasons for not allowing piggy backing of the > components? I know IPC-D-275 and it's replacement does not allow. I know > there will be an additional rework cost but if the board is laid out and > then engineering comes out with ECN that requires piggy backing of > components -People here want to avoid costly fab spin on relatively low > volume? > > There shall be some good quality and reliability reasons which I would > like to know. > > re, > Ken Patel. > > ------------------------------------------------------------------ > --------------- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt delivery of Technet send the following > message: SET Technet NOMAIL > Search previous postings at: www.ipc.org > On-Line Resources & > Databases > E-mail Archives > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > information, or contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > ------------------------------------------------------------------ > --------------- > --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------