>>> "Marsico, James"
<[log in to unmask]> 09/17/01 07:51AM >>>
We've been
struggling with solder beads recently, which, after an aggressive
aqueous
cleaning, have been found under some chip capacitors. We've
probably
had this problem all along, but we just got a new inspector who
decided to
look under components. Anyway, Our SMT operator decided to do
some
experimenting and added liquid flux to the solder paste (Why?
Beats
me!). The water soluble flux he added is the same formulation as
the flux
in the paste. Low and behold, the solder beads seem to have
been
significantly reduced. The only explanation I can think of is that
the
extra flux results in smaller beads which wash away and don't get
stuck
under the components. Any comments?
Jim
Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems
Group
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631-595-5879