>>> "Guy Ramsey" [log in to unmask]>
09/14/01 04:44PM >>
----------------- Message requiring your
approval (96 lines) ------------------
I suggest you start with IPC-7095 BGA
Implemntation Guide. It provide a very
brief but useful introduction to the
package and discussion of the
production and design issues. For more
detailed information consider John
Lau's Textbook Ball grind Array
Technology. ISBN 0-07-036608-X
Guy Ramsey
Senior Lab
Technician / Instructor
E-Mail: [log in to unmask] <mailto:[log in to unmask]>
Ph: (610)
362-1200 x107
Fax: (610) 362-1290
-----Original
Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Landes,
Jeff
Sent: Friday, September 14, 2001 9:17 AM
To:
[log in to unmask]
Subject: [TN] BGA process questions for assembly
vendors
My company has custom equipment manufactured for us, that we
design. In the
past we have not had to use BGA packages -- but we now
have components that
only come in BGA packages for upcoming designs.
I
am sending a question list to some vendors to start becoming familiar
with
their BGA capabilities, efforts and experience.
Here is
my list so far. Are there any more questions I should be
asking
from the start?
1) What BGA package types and
sizes have been placed on deliverable
product?
2) What
quantities have been delivered?
3) Was there a documented effort
that took place to qualify the production
process for BGA
product?
4) Was any outside testing performed on BGA product during
initial process
qualification?
5) Is there any documented
procedure that covers introducing a new BGA
package type or size to the
production line?
6) Is there any documented procedure that
covers introducing a new
assembly to the production line that has a BGA
package?
7) What type of rework equipment is available for
removal and replacement
of BGA packages?
8) Is a BGA
rework process documented?
9) What inspection methods are
used to judge the goodness of BGA placement
and
soldering?
10) Are there documented "acceptable" and
"rejectable" criteria for BGA
package placement and
soldering?
11) What process measurements are studied to determine
if the BGA placement
and soldering are "in control"?
12) Are
there any special process instructions used for BGA
manufacturing?
13) Are any special receiving inspection criteria in
place for BGA
components?
14) Are there documented
component storage criteria for BGA components?
Thanks in advance for
your comments.
Jeff