Hi Guy
 
When you are qualifying your solder paste please be sure to review the TGAs from the solder pastes and look at the residue being removed from the flux system during reflow (amount left on board and amount left in the furnace).  Depending on your throughput you may experience a high amount of residue given off and thus, will require more furnace maintenance in the system.
 
Karen
-----Original Message-----
From: Guy Ramsey [mailto:[log in to unmask]]
Sent: Wednesday, September 12, 2001 12:04 PM
To: [log in to unmask]
Subject: [TN] Solder paste qualification

I am looking for help with the process of solder paste qualification. Anyone, have input beyond IPC-J-STD-005 and the related Test Methods? A check list that they would be willing to share. I have been tasked with writing an article to appear in our newsletter and would be happy to give credit for any ideas that I use.
 

Guy Ramsey
Senior Lab Technician / Instructor

E-Mail: [log in to unmask]
Ph: (610) 362-1200 x107
Fax: (610) 362-1290

 


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