Expert Technetters! I'd value your opinions on the following. My company is starting development of a new microelectronics device that will be packaged in a new style of package. The substrate of the package will be made from FR4 laminate - maybe 0.30mm thick. The package will have two concentric rings of pads laid out something like this: _______________________________ | * * * * * * * | | * | | * * * * * * | | * * * | | * * * * * * | | * | | * * * * * * * | |_____________________________| I would have thought the obvious connection style would be BGA but my manufacturing minded colleagues want to use plain flat Ni/Au pads. Is this an acceptable design or are there issues with reliability, PCB population etc? Your opinions would be welcome. Regards, Eric Christison --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------