Steve - The immersion tin deposits are still in work - to date one deposit is till soldering like a champ after 500 days both storage conditions. The latest tin to be added to the test is at day 308, still going strong. Regards -----Original Message----- From: Steve Kelly [SMTP:[log in to unmask]] Sent: Thursday, September 27, 2001 5:39 PM To: [log in to unmask] Subject: Re: [TN] Circuit Coatings Shelf Life Excellent data - do you have anything similar for immersion tin. Thanks Steve Kelly -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Gerard O'Brien Sent: Thursday, September 27, 2001 4:47 PM To: [log in to unmask] Subject: Re: [TN] Circuit Coatings Shelf Life Ken, can not give times for those conditions, however I have presented a vast quantity of wetting balance data to the J-Std 003 committee on testing those finishes in real time, open on a shelf in both environmentally controlled storage as well as in a chemical storage shed. To cut to the chase , I ran out of test coupons for HASL after 800 plus days of continuous testing. Reduction in wetting force day one to day 800 was approximately 22 to 25%, storage location dependant. For Enig, ran out of coupons after 887 days, reduction in wetting force 33%, independent of storage location. OSP, ran out of coupons after 600 plus days (guess I thought it wouldn't last or something), reduction in wetting force 20 to 22% depending on storage location. Wetting times remained well below 1 second even after all this time. The time to reach max wetting force really only increased significantly for ENIG due to passivation of the nickel surface. All tests were performed using a type ROL0 flux as per j-std-004. The FR4 coupons were dipped 90 degrees to the solder pot in a classic edge dip wetting balance test. Buoyancy from the coupon is dealt with by the software for the wetting balance. If you store these finishes as you outline they should out perform my "worst case" conditions. Regards Gerard O'Brien. Photocircuits corp. -----Original Message----- From: Ken Hafften [SMTP:[log in to unmask]] Sent: Thursday, September 27, 2001 3:07 PM To: [log in to unmask] Subject: [TN] Circuit Coatings Shelf Life I am looking for the comparative shelf life for HASL, OSP, and ENIG at the following circuit board storage conditions: Taped bag (less than 70F and 50% RH) Vac-pak (less than 70F and 50% RH) Taped bag (greater than 70F, 60% RH) Vac-pak (greater than 70F, 60% RH) Thanks in advance for any help on this question. ------------------------------------------------------------------------ --------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ------------------------------------------------------------------------ --------- ------------------------------------------------------------------------ ---- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ------------------------------------------------------------------------ ---- ----- ------------------------------------------------------------------------ --------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ------------------------------------------------------------------------ --------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------