Dave,

Surely, not ALL 1700-lbs.? Wooo-doggies! I can only imagine what a task that
would be!!! I've read some stuff that if you keep the pot static, and keep it
at a stable temperature for a period (what this really is, I don't
know...there's varying opinions), the metals will seek their own level
(according to the different opinions, the copper will be towards the top),
then you scoop out out the top layer, and replenish what you've removed with
fresh bars.

The question that I have though, how did the pot get so out of balance with
copper? I've never had a problem with copper content, even when waving OSP
boards...tin levels dropping, yes. But not excessive copper...somebody throw
some pennies in the pot?

-Steve Gregory-

RJ Klien Wassink suggests [bible p 169] pouring contaminated solder at about
190°C through a 20 mesh stainless steel stariner to reduce copper content to
0.25%.

Dave Fish