-----Original Message-----
From: Guy Ramsey [mailto:[log in to unmask]]
Sent: August 22, 2001 5:03 PM
To: [log in to unmask]
Subject: [TN] Gold Tin Solder

We are looking for a resource, someone with experience evaluating Ag80SN20 solder process. Specifically concerning the microstructure of the intermetallic interface. We will need to talk off line.

 

Guy Ramsey
Senior Lab Technician / Instructor

E-Mail: [log in to unmask]
Ph: (610) 362-1200 x107
Fax: (610) 362-1290