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-----Original Message-----
From: Guy Ramsey [mailto:[log in to unmask]]
Sent: August 22, 2001 5:03 PM
To: [log in to unmask]
Subject: [TN] Gold Tin Solder


We are looking for a resource, someone with experience evaluating
Ag80SN20 solder process. Specifically concerning the microstructure of
the intermetallic interface. We will need to talk off line.
 
Guy Ramsey 
Senior Lab Technician / Instructor


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