To wave or not to wave, that is the question...
We've done several different assys (board sizes and complexities) using 0805's on side 2.  We have used a 2nd side adhesive step and cure prior to hand assembly insertion and Dover Soltec Wave soldering.  I will contact our process engineer to dig up solder wave profiles, adhesive spec, and cure times tomorrow and I will send them your way.  --Dean Lillibridge
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Kevin Stokes
Sent: Thursday, August 16, 2001 4:26 PM
To: [log in to unmask]
Subject: [TN] To wave or not to wave, that is the question...

Old problem: mounting ceramic capacitors to the bottom side of an assembly and your customer wants you to wave them on.

We are having problems with 0805 0.22 uF and 0.1 uF caps going through wave and cracking during the process.  We are following all of the standard protocols (preheat, etc.).  My understanding is that 0805s are typically capable of handling this process.

Anyone got any ideas short of moving the cap to the top or doing a double sided reflow?

Kevin

Kevin Stokes
Reliability Manager
Kimball Electronics Group
(812) 634-4207