Hi Leonel, if the processes are checked already and there seems to be no cause you might check your checks and focus on the results, if they clearly show that the particular process is definetly not the cause. For the solderability of bare boards and parts, there´s always a good portion of trust in solderability of a whole batch after checking some samples. Cleanliness is another major factor in this game, how is the handling done, is the dust removed prior to paste print (there´s always some of it right out of the sealed package), for how long do the printed boards wait until beeing reflowed, and what about temperature and humidity at these hot summer days, does your paste like it as it is now? Just a couple of things which I think can contribute to that what you´re seeing. If it happened suddenly, can you find out what has changed? Good luck Wolfgang --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------