Hi Lee, In a message dated 08/09/2001 14:53:17, [log in to unmask] writes: >Werner Engelmaier, >I'm not familiar with the work of Roger Wild concerning SnPb Solders. >What did he do? Are there any technical publications available? >I'm curious. Any help you can provide would be greatly appreciated. >Thanks >Lee Whiteman Roger Wild's now classical work characterized the temperature- and time-dependency of the creep-fatigue of Sn/Pb solders. The characterization was enough to allow the development of the Engelmaier-Wild solder creep-fatigue model that is widely used in the industry, which enables one to relate the results of proper accelerated testing (as per IPC-SM-785) to product reliability (IPC-D-279). You can his work at: R. N. Wild, "1974 IRAD Study - Fatigue Properties of Solder Joints," IBM Report No. M45-74-002, Contract No. IBM 4A69, 5 January 1975, among others. Werner Engelmaier --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------