Mark, IMHO, there will be no problem as long as the underlying copper was correctly prepared before hassling it. Your spec. allows a good tolerance beyond the limits. Brian Mark Hargreaves wrote: > > Hi All, > Our most recent HAL solder analysis report showed tin at 61.17% (report > spec is 61.5 - 63.5) and gold at 0.055% (report spec is 0.045%). > We're replacing the solder, but I'm wondering about the solderability of > boards that have already been processed. Will these levels not, possibly, > or certainly cause soldering problems? > > Thanks, > Mark > > --------------------------------------------------------------------------------- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL > Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 > --------------------------------------------------------------------------------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------