I can't definitely say no, but I am not aware of any studies. On a metallurgist's "list of things to look into" I don't think this would ever get a high rating as the likelihood of producing anything of significance to report on is pretty low. Melting points: Sn62 is 179C MP, Sn63 is 183C MP, and 183 -188C MR for Sn60 Mixing all these in some uncontrolled way might extend the pasty range of the solder mix to say 190C in worst case. Solder joints might have a slightly duller appearance. It is possible a skilled touch up operator might be able to detect the pasty range increase. Extended pasty ranges are generally regarded as undesirable but 10C should not be a problem. Why do you ask, is there a problem or has someone just noted the label on the touch up spool or ... Mike Fenner Indium Corporation of Europe T: + 44 1908 580 400 F: + 44 1908 580 411 M: + 44 7810 526 317 W: www.indium.com -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Grant Emandien Sent: Friday, August 03, 2001 4:07 PM To: [log in to unmask] Subject: [TN] Hi, Has anyone evaluated the effects of joint reliability (and any other consequences) of Sn63 and Sn62 solder joints when reworked/mixed with 60/40 solder? Thanks in advance Grant ********************************************************************** Notice: The information contained in this e-mail (including any attachments) may contain commercially sensitive or confidential information which may be legally privileged and is for the sole use of the intended recipient(s). If you are not, or believe you may not be, the intended recipient, you are hereby notified that any use, dissemination, copying, review, disclosure or action taken in reliance of this e-mail is prohibited and may be unlawful. If you have received this message in error, please notify the sender immediately by reply e-mail and delete all copies of the message. Any views expressed in this message are those of the individual sender unless expressly stated by the sender to be given on behalf of Tellumat (Pty) Ltd. Tellumat (Pty) Ltd disclaims liability for any unauthorised opinion or representation made by the sender on behalf of Tellumat (Pty) Ltd. No warranty is given by Tellumat (Pty) Ltd that the integrity or security of this e-mail (including any attachments) has been maintained through transmission, nor that the communication is free of virus, interception or interference. ********************************************************************** ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------