We've done several different assys (board sizes and complexities) using
0805's on side 2.  We have used a 2nd side adhesive step and cure prior to
hand assembly insertion and Dover Soltec Wave soldering.  I will contact our
process engineer to dig up solder wave profiles, adhesive spec, and cure
times tomorrow and I will send them your way.  --Dean Lillibridge

NEWvENTURE TECHNOLOGIES

    -----Original Message-----
    From: TechNet [mailto:[log in to unmask]]On Behalf Of Kevin Stokes
    Sent: Thursday, August 16, 2001 4:26 PM
    To: [log in to unmask]
    Subject: [TN] To wave or not to wave, that is the question...


    Old problem: mounting ceramic capacitors to the bottom side of an
assembly and your customer wants you to wave them on.

    We are having problems with 0805 0.22 uF and 0.1 uF caps going through
wave and cracking during the process.  We are following all of the standard
protocols (preheat, etc.).  My understanding is that 0805s are typically
capable of handling this process.

    Anyone got any ideas short of moving the cap to the top or doing a
double sided reflow?

    Kevin

    Kevin Stokes
    Reliability Manager
    Kimball Electronics Group
    (812) 634-4207