I have tried many time to use resistor arrays for the very reason you mention but ended up getting back to single resistor, here are a few reasons why : Layout : Resistor and capacitor arrays will reduce real estate only in the case of bus lines, and then they need to have a small enough pin pitch and kind off "drop-in" directly on top of the bus layout (which you usually don' t want to spread apart to match larger pith ... and loose real estate). Electrical: Serial resistor should be usable but then pull-ups and pull-downs have a common pin which can be a problem at high frequency due to the lenght of the inner line. This is also a problem for capacitor array since the path to ground might be too long. When used as terminator, resistor need to be placed at the very end of the line next to the last IC input pin, when busses are distributed around an IC, you don' t want to get it back out to the array. Jean-Luc Lehmann "Stephen R. Gregory" To: [log in to unmask] <SteveZeva@AO cc: L.COM> Subject: Re: [TN] Capacitor 0603 vs 0402...why not networks and arrays? Sent by: TechNet <[log in to unmask] ORG> 09.08.01 02:46 Please respond to "TechNet E-Mail Forum."; Please respond to SteveZeva Hi Glenn! I've read the responses you've received to your question (they've all been good), and want to ask another question... I assume the reason to use smaller passive components, is to reduce the real estate needed by these components. My question is; why isn't there more use of chip resistor networks and capacitor arrays? To me, it seems obvious that the use of these components will reduce real estate, but I don't see them being used as often as they could be...maybe I'm not aware of the electrical characteristics or something else, but I wonder why they aren't used more often in designs that are tight for space than what I've seen so far... Can anybody shed some light on this? -Steve Gregory- Hi all, I'm brainstorming on risks and benefits of 0603 caps vs 0402 caps. If the cap value, voltage rating, dielectric material, terminations, and use conditions are the same, would one be better than the other? My thoughts are it would be a wash or at least not significant. Here's what I have so far: Benefits of 0402 vs 0603: Smaller size reduces thermal stress/strain on solder joints from CTE or board flexing. Smaller size uses less real estate on board Risks of 0402 vs 0603: Equipment may have difficulty placing Thinner dielectric spacing to achieve same capacitance, cap higher failure rate Smaller size, cracks easier to develop Higher risk of tombstoning What do you all think? I'm sure I missed something, maybe even wrong on some of the above. Thanks, Glenn --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------