Hi folks, We're embarking on something new. We will be assembling boards with BGAs. Some are small and fine pitch, others are regular pitch but quite large (40mm square). We will be underfilling them with adhesive. Because we're underfilling, we have to clean the flux from underneath the parts. We're using an RMA flux based solder paste. Now for the question - how should I clean the flux from under these parts? Any clues as to which solvent to use? Any ideas on what type of equipment to use? I have at my disposal an in-line semi-aqueous cleaner and a vapor degreaser. Thanks for any insight. Kathie Lambert Process Engineer Northrop Grumman Baltimore, MD 410-765-9746 --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------