Hello Plating Experts!

I need to know some information for the various types of gold deposits
available for PWB surfaces. Much has been discussed regarding the processes
and thickness capabilities and I don't need you to go there. I'm more
interested in the deposits themselves, i.e. what is in the deposit and it's
properties (specifically density).

I know that electroplated gold can be supplied as "soft", i.e. for wire
bonding and "hard" i.e. for edge card connector fingers/tabs. What are the
basic differences between the gold deposits and what can I expect the
density of the deposits to be?

I know somewhat about electroless gold in it's classic form as discussed
many times in TechNet. However, I have heard that electroless gold comes in
"auto catalytic" and "non auto catalytic (?)" flavors. If this is true, what
are the basic differences between these deposits and what can I expect the
density of the deposits to be?

Finally I'd like to know more about the immersion gold deposit and it's
density.

Thanks in advance

/Gerry

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