Hello Plating Experts! I need to know some information for the various types of gold deposits available for PWB surfaces. Much has been discussed regarding the processes and thickness capabilities and I don't need you to go there. I'm more interested in the deposits themselves, i.e. what is in the deposit and it's properties (specifically density). I know that electroplated gold can be supplied as "soft", i.e. for wire bonding and "hard" i.e. for edge card connector fingers/tabs. What are the basic differences between the gold deposits and what can I expect the density of the deposits to be? I know somewhat about electroless gold in it's classic form as discussed many times in TechNet. However, I have heard that electroless gold comes in "auto catalytic" and "non auto catalytic (?)" flavors. If this is true, what are the basic differences between these deposits and what can I expect the density of the deposits to be? Finally I'd like to know more about the immersion gold deposit and it's density. Thanks in advance /Gerry --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------