You referred to a home base aperture for the stencil, I would assume you are referring to your chip type components. If so we had some problems also and we did a "modified V" apertures in our stencils for all chip components.
08/21/01 03:31 PM
Please respond to "TechNet E-Mail Forum."
To: [log in to unmask] cc:
Subject: Re: [TN] Solder Beads (not solder balls)
You might want to check your environmental conditions, if very hot and humid
it could lead to more slumping than anyone would like, esp with water
soluable.
-----Original Message-----
From: Jorge Rodriguez [mailto:[log in to unmask]]
Sent: Tuesday, August 21, 2001 2:57 PM
To: [log in to unmask]
Subject: [TN] Solder Beads (not solder balls)
Fellow technetters,
We are having tons of issues with solder beading, even on boards were we
didn't have the issue before. We're clueless, we suspect of the solder paste
(63-37 Water Soluble), it looks slumpy amd watery, but we're not sure. I
know solder beading can be solved by designing the stencils with home-base
aperture, but what we're seeing here is across the board, not just one
particular assembly but several. Does anyone have experience dealing with an
issue like this?, could solder beading caused by the oven profile or is it
more like solder paste related?
Any comments would be appreciated.
Jorge Rodriguez
Process Engineer
Varian Electronics Manufacturing
E-mail: [log in to unmask]
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