I have recently come upon a requirement to encpasulate/pot a small PCB assy
containing a T/H transformer. Size is approx .5"W x .5"L x .3" H

Can anyone who has experience in "Potting" or "encapsulating"
technologies ,especially potting PCB assemblies, give me some
hints/starting points, etc.

I would be very interested in any issues to watch out for, recommended
potting materials, equipment, standards to adhere to, tests, etc.
Basically anything that would be helpful.

Thanks in advance,
John

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