Hi, An invitation for this event was sent out last week. Please note the date has changed. Also, for those who do not know, Arlington Hgts, is in Illinois, near O'Hare airport west-northwest of Chicago. Best regards, Mario Irigoyen Subject: PLEASE NOTE: DATE CHANGE FOR THE DDI SEMINAR!!! Unfortunately, we had to change the date of our seminar. PLEASE SEE THE ATTACHED INVITE BELOW FOR THE DDI TECHNICAL SEMINAR WHICH WILL BE HELD ON THURSDAY, NOVEMBER 1ST at the Sheraton, Arlington Park. Feel free to forward this invite along to anyone in your company or outside of your company that would like to attend. Please RSVP to the following email address by OCTOBER 18TH: [log in to unmask] We look forward to seeing you there!!! COMPLIMENTARY SEMINAR IN THE LATEST HIGH SPEED AND HIGH DENSITY DESIGN SOLUTIONS DEMONSTRATING THE LATEST KNOW-HOW AND JAPANESE BEST PRACTICES PROVIDED BY DDI, ZUKEN AND PANASONIC. Do your designs have BGA's ? Is an increasing I/O count and a decreasing pitch driving up the layer count on your PCB and compromising the electrical performance requirements of the PCB ? Learn how the most recent applications of HDI (microvia) technology to high speed, high density, large form factor products has reduced PCB cost by up 50% or more (through size reduction and/or layer count reduction) and significantly improved electrical performance characteristics !! Example 1 : High Speed Optical Network at 10Gb/sec, Avionics. Layer count reduced from 18 to 10. Size/weight reduced by 35%. Design time reduced by 25%. PCB cost reduced by 55%. Example 2 : High speed network product. Two 18 layer daughter cards and one 24 layer motherboard, combined into one 16 layer mother board. PCB cost reduced by almost 60%. Combined assy and PCB savings exceed the cost of the original PCBs. In both cases shorter connections to power and ground and shorter signal lengths reduce inductance and resistance. Over 50% fewer drilled holes significantly improved ground plane continuity. Outer layer power and ground provides free decoupling capacitance. Could you benefit from such a solution ? Learn about the most recent PCB concepts and solutions and their design implementation before your competition does. Don't miss this non-commercial technical design seminar provided by some of the leading industry experts in PCB design solutions. Please forward this message and the attached flier to others within your company or outside who might find this seminar useful. Please RSVP by OCTOBER 18, 2001 to Fran Gallo [log in to unmask] Tel (847) 255-6920 --------------------------------------------------------------------------------- DesignerCouncil Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF DesignerCouncil. To set a vacation stop for delivery of DesignerCouncil send: SET DesignerCouncil NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------