John, The things I wonder consider are, 1. Find out if heat is an issue, the potting material may need to be thermally conductive. 2. If getting under components etc. is important then the viscosity of the potting material is critical. If you do need to get under things then preheating the pcb should help. 3. If a mold is required, then definitely build in some draft into the mold, it will make opening the potted assembly much easier. Hope this helps, Mike Di Giacomo, Process Development Engineer WorldHeart Corp. -----Original Message----- From: John Fahey [mailto:[log in to unmask]] Sent: Thursday, August 16, 2001 10:57 AM To: [log in to unmask] Subject: [TN] ''Encapsulating/Potting PCB Assemblies" I have recently come upon a requirement to encpasulate/pot a small PCB assy containing a T/H transformer. Size is approx .5"W x .5"L x .3" H Can anyone who has experience in "Potting" or "encapsulating" technologies ,especially potting PCB assemblies, give me some hints/starting points, etc. I would be very interested in any issues to watch out for, recommended potting materials, equipment, standards to adhere to, tests, etc. Basically anything that would be helpful. Thanks in advance, John ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------