If the board can not be dip-coated prior to assembly. I would recommend manual solder and de-solder the pad (make sure you remove the solder which dissolve the gold) prior to assembly. Hopefully, you only dealing with few (Engineering mistake usually are very costly)...my 1.34 cents. jk -----Original Message----- From: Tamir Ben Shoshan [mailto:[log in to unmask]] Sent: July 15, 2001 10:29 AM To: [log in to unmask] Subject: [TN] Applying HAL on Electroles Nickel Gold Hello All, An engineering mistake at the PCB fabricator caused a deviation at the drilling size of some press fit connectors (the tools were designed to HAL when the coating was Ni-Gold). I wonder if an addition selective HAL on the component's area (with the NI-Au) can be implemented and still stay with high reliability boards (with reference to the brittle intermetalics alloy that can be formed with time at that area). I have to say that those bare boards are very expensive and complicated(28 layers, 18"x18") Tamir B. Shoshan ------------------------------------------------------------------------ --------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ------------------------------------------------------------------------ ---------