Dear TechNetters:

As we know that the preferred metal surface finishes are HASL, EN/IG
(Electroless Nickel and Immersion Gold, and OSP etc.

It's reported that EN/IG(also called immersion gold) suface may lead
unreliable solder joint for BGA component,  and suggest do not use
immersion gold for designs that have BGAs.

Please give your advices.

Thanks with best regards,
Zhangshoukai, PE, Huawei Technologies.

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