Dear TechNetters: As we know that the preferred metal surface finishes are HASL, EN/IG (Electroless Nickel and Immersion Gold, and OSP etc. It's reported that EN/IG(also called immersion gold) suface may lead unreliable solder joint for BGA component, and suggest do not use immersion gold for designs that have BGAs. Please give your advices. Thanks with best regards, Zhangshoukai, PE, Huawei Technologies. --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------