Good morning TN's Mr. Hogan I believe I too would like to have a copy of Rheology -Vs- Print, 101. Barry Gallegos Process Engineer Western Electronics 1550 S. Tech Lane Meridian, Idaho, 83642 P- 208.955-9771 F- 208.955-9755 -----Original Message----- From: James-Kester [mailto:[log in to unmask]] Sent: Thursday, July 05, 2001 3:47 AM To: [log in to unmask] Subject: Re: [TN] Solder stencil printing validation Dear Mr. Hoggan , I appreciate if can get your "paste rheology vs print, 101" Best regards, James Wang Litton Components [log in to unmask] Tel . 886-2-89121066 Fax . 886-2-89121072 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Andrew Hoggan Sent: Tuesday, July 03, 2001 2:40 AM To: [log in to unmask] Subject: Re: [TN] Solder stencil printing validation If you're trying to develop parameters that determine whether the print process is in spec or whether the solder paste is within spec or if you trying to determine which part of the process is not within specification, then you must understand or know the dynamic rheology response of the solder paste with respect to yield stress, recovery, and frequency response. You can forget about relative viscosity such as that generated by Malcom or Brookfield types of measurement and the much quoted thixatropic indices or 'rheology curves'; you need to know the absolute dynamic rheology of the material. If you want to know more contact me offline, I can send you 'paste rheology vs. print, 101'. Best regards, Andrew Hoggan BBA Associates Ltd www.bba-associates.com -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Carroll, George Sent: Monday, July 02, 2001 07:25 To: [log in to unmask] Subject: [TN] Solder stencil printing validation I'm looking for references or written guides and any helpful recomendations to identify parameters to investigate and construct a robust and meaningful solder paste stencil printing process validation. After checking through the archives, I found a posting which pointed to an FDA document. Alas, the document no longer exists. I'm looking to find what observations and measurments other than the obvious accuracy, volume, height and paste age. George Carroll Process Engineer, Siemens Energy & Automation P.O. Box 1255 3000 Bill Garland Road Johnson City, TN 37605 (423) 461-2948 [log in to unmask] ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------