Hi Bill, Just a few quick suggestions, 1. Is there any draft built into the mold? It would make ejecting the part a lot easier. 2. Can you make the mold itself from a flexible material? This too would make getting the parts out easier. Hope this helps, Mike Di Giacomo WorldHeart Corp. -----Original Message----- From: Kasprzak, Bill (sys) USX [mailto:[log in to unmask]] Sent: Monday, July 16, 2001 11:51 AM To: [log in to unmask] Subject: [TN] Recommendations for developing a mold Hello all, I am involved with a project that requires that I encapsulate a pc board in mold so that when completed, it will be a ring with an ID of 1.37" and an OD of 1.64". The ring will be .13" thick and .35" tall. There will be six, 28 AWG wires exiting the finished potted assembly. The potting compound will be Emerson & Cumings 2651-40 with Catalyst 11. I have a basic 3 piece mold that works OK, but the pieces only reflect what the final product should look like. It takes a little work to get the mold apart even though mold release is used. The cure for the potting is 8 - 16 hours at 180 deg F What I'm looking for is any tricks and hints that should be incorporated into the mold design that would facilitate easy processing. What I mean is to make it easier to pour the material, easy to assemble into the mold, easy to take apart, etc. etc. Right now the whole process just seems to be crude and messy. Maybe, that's just the nature of the beast. Any and all responses appreciated. Thanks. Bill Kasprzak Moog Inc., Electronic Assembly Engineering ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------