To all: I've been reading, with great interest, the responses so far to the use of 2% silver paste. I am not being critical of the folks who responded so far but, each one cites a "reported" or "understood" advantage to using 2% paste. I have also heard some of same reasons for considering a switch to a 2% silver paste. Can any of the metallurgists on this forum confirm some of these reported advantages and perhaps recommend that given x,y, and z, one should consider using 2% silver solder alloys? Good topic. Bill Kasprzak Moog Inc., Electronic Assembly Engineering > -----Original Message----- > From: Eric Christison [SMTP:[log in to unmask]] > Sent: Thursday, July 26, 2001 4:20 AM > To: [log in to unmask] > Subject: Re: [TN] solder paste with 2% silver > > > I always understood that you had to use a paste with 2% silver if you > > were using components > > with terminations containing Palladium. The 2% silver is also supposed > to > > five you a shinier > > finished solder joint. > > > > Steve. > > > > Larry Koens wrote: > > > > > Got a question for everyone, > > > > > > I just switched companies and the new company that I'm with now uses a > > > 62/36/2 solder paste. I've always used the 63/37 formula. The guys who > > > decided to use the 2% silver are no longer with the company. My > > question > > > to you is, why would they want the 2% silver in the paste? They know > > > something I don't?! > > > > > The silver should give the alloy higher strength, better creep resistance > and a higher melting point. Perhaps your application benefits from one of > these differences? > > Regards, > > > > Eric Christison > > -------------------------------------------------------------------------- > ------- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt delivery of Technet send the following message: SET > Technet NOMAIL > Search previous postings at: www.ipc.org > On-Line Resources & Databases > > E-mail Archives > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 > ext.5315 > -------------------------------------------------------------------------- > ------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------