Do any IPC standards (particularly IPC-610-C)recommend standard magnification, distance, and time for inspecting surface mount solder joints? Some of our internal inspectors can spend up to 5 mins per small PCB assy under 30x magnification to investigate and find minor fracture in solder joint(say 1/1000 units)supplied by our CM's. These units have already gone through 3 rounds on 100% visual inspection at the CM. These units pass Functional test. My worry is that our inspectors feel that they NEED to find visual defects in order to show that they are doing their job effectively! Unfortunately, finding 1 defect in a batch of 1000 assemblies under high magnification with ample time to twist and turn the board under inspection, results in us having to do 100% inspection on every unit from our CMs! Does anyone have any input at all on this issue? Thanks. --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------