From: Guy Ramsey [mailto:[log in to unmask]] Sent: Friday, June 01, 2001 4:56 PM To: TechNet E-Mail Forum.; Mary Jane Chism Subject: RE: [TN] Exposed copper IPC-A-600F states that this is a defect in all classes and requires disposition. This specification is for boards before they are subjected to the rigors of the assembly process. IPC-A-610C states that Blisters/Flaking expose bare copper is a process indicator for class 2 and 3. Meaning it merits attention and some form of corrective action should be taken to prevent reoccurrence of the condition but it is not a cause for rejection: Unless the condition affects the form, fit or function of the product in its end use environment. As a contract manufacturer you will probably need to discuss this matter with your customer. As an OEM you would have to work with your engineering staff to asses risk. IMHO a decision like this should not be made based on a dogmatic interpretation of the specifications. This is one of those areas where a Black or White call may cost a significant amount of money and set precedence that are far reaching. Guy Ramsey Senior Lab Technician / Instructor E-Mail: [log in to unmask] Ph: (610) 362-1200 x107 Fax: (610) 362-1290 -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Mary Jane Chism Sent: Friday, June 01, 2001 12:32 PM To: [log in to unmask] Subject: [TN] Exposed copper I have a question concerning the subject matter of "exposed copper" on conductors and/or ground planes due to missing solder mask. I have reviewed the IPC-A-600 and SM-840 and have came to a conclusion on this. I want to hear from the experts, which includes all of you, the interpretation of this condition. I want to know if this is a defective condition or not, what makes it defective, or if it is acceptable; anything you all want to tell me. Thanks much. Mary Jane Chism Technical Trainer/ Learning Center Kimball Electronics Group Phone: (812) 634-4462 Fax: (812) 634-4501 email: [log in to unmask] --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------