Hi TechNet! I have an opportunity to include a couple of flipchip and/or
component underfill materials into a DOE we have planned. Rather than
perform an old fashioned literature search I thought I would cheat and ask
the TechNet community members who are using a flipchip and/or component
underfill material for a recommendation. The only caveat I have is that I
would like to investigate underfill materials with a cure around 125C
instead of the typical 150C if such a material is available. I will take
everyone's recommendations and put a anonymous "top ten" list back on
TechNet for everyone's use. TIA

Dave Hillman
Rockwell Collins
[log in to unmask]

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