Hi TechNet! I have an opportunity to include a couple of flipchip and/or component underfill materials into a DOE we have planned. Rather than perform an old fashioned literature search I thought I would cheat and ask the TechNet community members who are using a flipchip and/or component underfill material for a recommendation. The only caveat I have is that I would like to investigate underfill materials with a cure around 125C instead of the typical 150C if such a material is available. I will take everyone's recommendations and put a anonymous "top ten" list back on TechNet for everyone's use. TIA Dave Hillman Rockwell Collins [log in to unmask] --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------