Ladies and others, Steve is kindly posting more ugly pictures of the continuing component failure analysis saga. Damn exciting stuff, eh? The first picture shows a "normal" view of the device in question's x-section. The basic construction is shown but please note the transistor warpage conforming to it's eutectic bond that varies significantly in thickness as in the next image. Don't know if this is a problem. Does GaAs like to "bend" that much? is the thin section of the eutectic causing thermal problems? I don't know because I ain't no semiconductor expert like some of you who have kindly answered before. Input appreciated with a promise of more ugly pics not the leas of which will be SEM/EDX analysis of the "real" construction and the show stopper as acoustic microscopy images taken from the bottom side of the device after the CIC flange is ground and polished to a respectable depth so a 100 Mhz transducer can sonically examine the various layers for voiding or other anomalies. Jeez, isn't this great? MoonMan --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------